Inforce 6309 SBC, Linux OS Snapdragon410E, 1GBDDR3 - 8GB eMMC

Snapdragon 410E processors are designed to meet the demanding requirements of embedded computing applications with its high performance, energy efficiency, multimedia features, and integrated connectivity. 

• Qualcomm® Snapdragon™410E processor (APQ8016E SoC)
  • Quad-core ARM® Cortex® A53 64-bit CPU @1.2GHz each, ARMv8-A ISA compliant 
  • Adreno™ 306 GPU with support for OpenGL ES 3.0, DirectX, and OpenCL
  • Hexagon™ QDSP6 @700MHz for ultra-low power audio and computer vision processing
  • Integrated ISP with support for 1.5GPs throughput
• 1GB LPDDR3 RAM @533MHz + 8GB eMMC (eMCP package)
• MicroSD card connector
• 802.11 b/g/n 2.4GHz WiFi, BT 4.1 LE, GPS
• 10/100/1000Mbps Ethernet on an USB2.0 to GbE controller
• Supports dual-cameras (13MP total) on MIPI-CSI
• LVDS-based panel and touch screen display supporting WUXGA 1920 x 1200,
• 24-bit/pixel or QXGA 2048 x 1536
• µHDMI output for HD1080p @30fps video and HD audio
• Miracast™ support, WiFi wireless streaming to external 720p display

• µHDMI Rev 1.3a for 1080p HD
• Dual MIPI-CSI2 (4/2-lane)—dual cameras up to 13MP
• H.264 playback and capture @1080p
• H.265 playback @720p
• HD 5.1 Audio and mic-in
• BT4.1 and Wi-Fi
• GPS/GLONASS 
• µSD card connector
• 2 x USB 2.0 (Host), 1x USB 2.0 (Debug)
• 26-pin expansion header with  I2C, SPI, I2S, 2x UART, 20x GPIO
• Power-over-Ethernet (PoE) and RS485 port (Optional, via an interface card)
• LVDS for touch screen displays (see FAQ for more details)

• Power: +12V Input Socket (1.5A typ.)
• Dimensions: 54mm x 85mm (Micro-SBC; credit card size)
• Operating Temp: -30ºC to +85ºC
• Relative Humidity: 5 to 95% non-condensing
• RoHS and WEEE compliant
• Shorter profile of 16mm